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22 September 2023
by Carlo Munoz
DARPA’s Diverse Accessible Heterogeneous Integration effort is developing transistor-scale heterogeneous integration processes seeking to combine advanced compound semiconductor wafers with CMOS technology. Pictured here is a DAHI wafer. (Northrop Grumman)
The US Department of Defense (DoD) has officially announced the eight new research and development (R&D) hubs in the United States that will make up the department’s new Microelectronics (ME) Commons.
The ME Commons initiative, funded through the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act of 2002, is designed to “get the most cutting-edge microchips into systems our troops use every day … [while] reducing our reliance on foreign components, keeping us safe from the risks of supply chain disruption”, Deputy Defense Secretary Kathleen Hicks said during a 20 September briefing at the Pentagon.
Managed by the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS), Other Transaction Authority (OTA), and Naval Surface Warfare Center (NSWC), the ME Commons will interconnect the series of regional R&D hubs focusing on different sectors of ME capability development.
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